New PDF release: Arbitrary Modeling of TSVs for 3D Integrated Circuits

By Khaled Salah,Yehea Ismail,Alaa El-Rouby

ISBN-10: 3319076108

ISBN-13: 9783319076102

ISBN-10: 3319374974

ISBN-13: 9783319374970

This publication offers a wide-band and expertise self sustaining, SPICE-compatible RLC version for through-silicon vias (TSVs) in 3D built-in circuits. This version bills for numerous results, together with pores and skin impression, depletion capacitance and within sight touch results. Readers will reap the benefits of in-depth insurance of innovations and know-how comparable to 3D integration, Macro modeling, dimensional research and compact modeling, in addition to closed shape equations for the via silicon through parasitics. innovations coated are verified through the use of TSVs in functions comparable to a spiral inductor and inductive-based conversation approach and bandpass filtering.

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Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing) by Khaled Salah,Yehea Ismail,Alaa El-Rouby

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